Heat dissipation structure for electronic apparatus component

ABSTRACT

A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A laterally Enlarged heat sink section is integrally formed on the evaporating end portion and has a flat bottom side and an arcuate top side. The integral heat sink section is resiliently deflected into the die recess, and has its flat bottom side resiliently pressed against the thermal interface pad, by a spring plate portion of a clamping structure downwardly engaging the arcuate top side of the heat sink section. During operator of the microprocessor, die heat is transferred to the metal shield wall sequentially through the thermal pad and the heat pipe, and then dissipated from the shield wall using fan-generated cooling air flowed along the shield wall.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation-in-part of U.S. application Ser. No. 09/123,092 filed on Jul. 27, 1998 and assigned to the assignee of the instant application.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to computer apparatus and, in a preferred embodiment thereof, more particularly relates to heat dissipation apparatus for computer microprocessors.

2. Description of Related Art

As computer microprocessors are provided with faster and faster clock speeds, the operating heat which these devices generate, and must be appropriately dissipated, correspondingly increases. The typical microprocessor used in a computer has a die portion (the microprocessor proper) which is exposed within a recessed area on the top side wall of the processor housing module (or “can”) which is mounted on the computer's system board.

The operating heat from this type of recessed processor die has heretofore been dissipated using a die cast metal heat sink screwed down to the top side of the processor housing module over the recessed die. In order to provide the requisite heat transfer interface between the bottom side of the heat sink and the top side of the recessed die it was necessary to place a layer of thermal grease between the top side of the die and the underside of the metal heat sink. As is well known, while thermal grease provides a good heat conduction path between the die and the heat sink, it is considered to be an undesirable interface material from a manufacturing standpoint because it tends to be quite messy and is easily spread beyond its originally intended location.

A potentially better interface material is a compliant thermal interface pad compressed between the bottom side of the heat sink and the top side of the die. However, in practice the use of such a compliant thermal interface pad in lieu of thermal grease has not been practical with current high speed microprocessors of this general type due to two design criteria—namely, bond line thickness and die pressure.

Bond line thickness refers to the variable height between the top side of the recessed die and the top side of the processor housing, the variation in the bond line thickness arising due to manufacturing tolerances. TO compensate for this dimensional variance in bond line thickness, and to provide the necessary compression of a compliant thermal interface pad, the thermal interface pad must have a thickness that undesirably reduces the amount of die operating heat conducted therethrough. Specifically, the pad must have an initial undeformed thickness that extends from the top side surface of the recessed die to above the top side of the processor housing. Additionally, at least one manufacturer of high speed microprocessors of this type is now specifying a maximum pressure which may be exerted on the die. Thus, particularly when the bond line thickness is at the low end of its manufacturing tolerance level, the compression of a thermal interface pad against the die by the overlying, rigidly attached die cast heat sink can easily exceed this maximum design pressure.

Thus, the use of thermal grease as the heat transfer interface between the heat sink structure and the top side of the die has been the only technique that compensates for bond line thickness variations, while at the same time preventing excess pressure from being exerted by the heat dissipation apparatus on the recessed die and providing a satisfactory heat conduction path between the die and the heat sink secured to the top side of the processor housing. The bond line thickness variation from processor to processor, of course, makes it quite difficult to apply the correct amount of thermal grease to ensure that an efficient thermal interface is provided between the die and the overlying heat sink, while at the same time avoiding the attendant mess of placing too much grease in the die recess. As a practical matter, the amount of grease must be that which generally corresponds to the lowest die level within the housing recess (as determined by the manufacturer's bond line thickness tolerance range). Thus, when the top side of the die is at the low end of the bond line thickness tolerance range (i.e., at its highest permissible point within the die recess), the applied quantity of thermal grease is more than is needed. This undesirably aggravates the tendency of thermal grease to “migrate” and generally create a mess.

As can readily be seen from the foregoing, a need exists for an improved technique for dissipating operating heat from a recessed microprocessor die, of the type generally described above, without the previous necessity of using thermal grease as the heat transfer interface between the top side surface of the die and the heat dissipation apparatus overlying the die. It is to this need that the present invention is directed.

SUMMARY OF THE INVENTION

In carrying out principles of the present invention, in accordance with a preferred embodiment thereof, electronic apparatus having a heat-generating component is provided with specially designed heat dissipation apparatus operative to dissipate operating heat from a surface of the component. Representatively, the heat dissipation apparatus includes a heat transfer structure having a portion movable toward the surface; an integral heat sink section disposed on the heat transfer structure portion for movement therewith into heat-receiving proximity with the surface; and a force exerting structure operative to move the integral heat sink section into heat-receiving proximity with the surface.

The heat dissipation apparatus is illustratively incorporated in a computer system in the form of a portable notebook computer having a microprocessor and a data storage device operative to store data retrievable by the microprocessor. The microprocessor is the component with which the heat dissipation apparatus is operatively associated, and is of a type having a housing with an exterior wall having a recess formed therein, and a die portion inset within the recess and having a side surface from which the heat dissipation apparatus receives microprocessor operating heat.

In an illustrated preferred embodiment of the heat dissipation apparatus, the heat transfer structure includes a heat conductive support structure, representatively a sheet metal EMI shield wall, which overlies the processor housing die recess, and a thermosyphoning heat pipe. A condensing end portion of the heat pipe is flattened and is anchored to the underside of the shield wall, in a heat transfer relationship therewith, while the evaporating end of the heat pipe has a circular cross-section, overlies the die recess and is resiliently deflectable toward the side surface of the die. The flattening of the condensing portion of the heat pipe improves heat transfer from the heat pipe to the shield wall. While the condensing portion of the heat pipe is representatively placed in thermal communication with the shield wall, it could alternatively be placed in thermal communication with another heat-receiving structure such as, for example, a portion of the computer chassis.

The integral heat sink section is defined by a laterally enlarged evaporating end portion of the heat pipe and has a flat side which faces a thermal interface pad placed on the side surface of the die, and an opposite arcuate side. When the heat pipe evaporating end portion is resiliently deflected toward the die, the flat side of its integral heat sink section is pressed against the outer side surface of the thermal interface pad.

The force exerting structure is representatively a clamping structure carried by the microprocessor housing, and has a movable resilient spring plate member which may be clamped against the arcuate side surface of the integral heat sink section to move the heat sink section into the die recess and resiliently clamp its flat side against the outer side of the thermal pad, thereby placing the laterally enlarged heat sink section in operative heat-receiving proximity with the side surface of the die.

During operation of the microprocessor, die operating heat is transferred to the shield plate sequentially through the thermal pad, the integral heat sink section and balance of the heat pipe. Operating heat received in this manner from the die is dissipated from the shield wall by a fan that flows air along the shield plate. Representatively, the microprocessor and the heat dissipation apparatus are disposed in the base housing of a portable notebook computer, and the fan operates to draw cooling air through the base housing, flow the air along opposite sides of the shield wall, and then discharge the heated air from the base housing.

The unique construction of the heat dissipation apparatus permits it to be operatively associated with the die without the undesirable use of thermal grease as the interface between the die and the heat dissipation apparatus. Instead, a thermal pad is used as such interface. Due to the variable movement of the integral heat sink section of the heat pipe evaporating end portion into the die recess, and the resilient clamping of the integral heat sink section against the thermal pad, the thermal pad can be quite thin, and does not have to extend outwardly from the die recess in its uncompressed state. Accordingly, the thickness of thermal pad may be minimally sized in a manner such that the pad provides a highly efficient conductive path between the die and the integral heat sink section of the heat pipe evaporating end portion.

Because the integral heat sink section is deflectable a variable distance into the die recess to bring the heat sink section into resiliently clamped contact with the thermal pad therein, the heat dissipation apparatus automatically compensates for variations in the bond line distance of the microprocessor. Additionally, since the clamping structure resiliently clamps the integral heat sink section against the thermal interface pad, excessive pressure forces on the die may easily be avoided. The use of the resilient spring plate member facilitates the avoidance of the exertion of excess clamping pressure on the die.

The heat dissipation apparatus is self-adjusting in yet another manner due to cantilevered support of the resiliently deflectable heat pipe evaporating end portion, and the configuration of its integral heat sink section. Specifically, in the event that the flat bottom side of the integral heat sink section is not precisely parallel to the top side of the die before the clamping structure is used to press the heat sink member against the thermal pad, the subsequent resilient downward force of the spring plate member on the curved upper side of the heat sink member will automatically impart a small degree of twist to the evaporating end portion, when the flat bottom side of its integral heat sink section initially contacts the thermal pad, in a manner such that the flat bottom side of the integral heat sink section bears against the thermal pad in a precisely parallel relationship with the top side of the heat-generating processor die.

While the heat dissipation apparatus of the present invention is representatively utilized in conjunction with a recessed processor die, it could also be utilized to advantage in a wide variety of other heat dissipation applications as well, and is not in any manner limited to removing operating heat from a recessed processor die.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a representative computer system in which the present invention is incorporated;

FIG. 2 is a simplified, partially cut away perspective view of a portable notebook computer embodiment of the computer system;

FIG. 3 is an enlarged scale schematic cross-sectional view through a microprocessor portion of the portable computer, taken along line 3—3 of FIG. 2, and additionally illustrates specially designed heat dissipation apparatus operatively associated with the microprocessor and embodying principles of the present invention;

FIG. 4 is an enlarged scale partial left end elevational view of the portable computer;

FIG. 5 is an enlarged scale top side perspective view of the microprocessor and associated heat dissipation apparatus;

FIG. 6 is a top side perspective view similar to that shown in FIG. 5, but additionally illustrating a portion of a sheet metal EMI shield wall overlying the microprocessor and supporting a heat pipe portion of the heat dissipation apparatus;

FIG. 7 is a bottom side perspective view of the microprocessor, the heat dissipation apparatus, and the shield wall portion shown in FIG. 6;

FIG. 8 is a view similar to that in FIG. 5 but illustrating the microprocessor and an alternate embodiment of the heat dissipation apparatus; and

FIG. 9 is an enlarged scale schematic cross-sectional view, similar to that in FIG. 3, taken through the microprocessor portion of the portable computer and the alternate heat dissipation apparatus associated therewith.

DETAILED DESCRIPTION

Schematically depicted in FIG. 1 is a computer system 10 which includes a CPU unit 12 operatively connected to a monitor 14, a keyboard 16 and a pointing device 18 and having a microprocessor 20 and a data storage device, representatively a hard disk drive 22, operative to store data retrievable by the microprocessor 20. The microprocessor 20 and the data storage device 22 are disposed within a housing portion 12 a of the CPU unit 12.

The computer system 10 is representatively embodied in a portable notebook computer 24, illustrated in FIGS. 2 and 4, in which the microprocessor 20 and the hard disk drive 22 are disposed within a rectangular base housing 26 having top and bottom side walls 28 and 30, left and right end walls 32 and 34, and front and rear side walls 36 and 38. The base housing 26 and its internal components thus form the CPU unit 12 schematically depicted in FIG. 1.

The keyboard 16 has a series of manually depressible keys 16 a and is positioned within an opening 40 formed in the top side wall 28 of the base housing 26 and overlies a sheet metal EMI shield wall 42 (see FIGS. 2, 3, 6 and 7) disposed within an upper interior side portion of the base housing 26 beneath the keyboard 16 and having upper and lower sides 42 a,42 b. The hard disk drive 22 underlies the shield wall 42 and is positioned adjacent the left end wall 32 of the base housing 26. Representatively, the microprocessor 20 is disposed somewhat to the right of the hard disk drive 22 beneath the shield wall 42. A conventional pointing stick (not shown) is positioned between a centrally oriented group of the keys 16 a and forms the pointing device 18 schematically shown in the FIG. 1 diagram.

A relatively thin rectangular lid housing 44 is secured by a hinge mechanism 46 to a rear top side edge portion of the base housing 26 for pivotal movement relative thereto between an upwardly pivoted opened use orientation, shown in FIGS. 2 and 3, in which the front or inner side 48 of the lid housing 44 faces the user of the computer, and a downwardly pivoted closed position (not shown) in which the lid housing 44 extends across and covers the top side 28 of the base housing 26. Conventional cooperating latch structures 50 a,50 b respectively disposed on the base and lid housings 26 and 44 serve to releasably lock the lid housing 44 in its closed position. A display screen 52 is operatively carried on the front side 48 of the lid housing 44 which, with the display screen 52, forms the monitor portion 14 of the computer system 10 schematically depicted in FIG. 1.

Turning now to FIGS. 3 and 5-7, the microprocessor 20 underlies the EMI shield wall 42 and is secured to the top side of a main system board 54 (see FIG. 3). Microprocessor 20 has a relatively thin rectangular housing portion 56 disposed somewhat above the system board 54 and having opposite top and bottom sides 58 and 60. A generally rectangular recess 62 is centrally formed in the top housing portion side 56. The die portion 64 of the microprocessor 20, which generates the bulk of the microprocessor operating heat, is positioned on the bottom side of the recess 62 and has a top side 64 a which is downwardly offset from the top side 58 of the housing 56 by a distance commonly referred to as the “bond line” distance of the microprocessor.

According to a key aspect of the present invention, specially designed heat dissipation apparatus 66 is thermally communicated with the die 64 to dissipate operating heat therefrom. AS will be seen, the heat dissipation apparatus 66 efficiently carries away operating heat from the die 64 without the necessity of using thermal grease to form a heat transfer interface between the top side 64 a of the die 64 and the heat dissipation apparatus, automatically compensates for variations in the bond line distance of the microprocessor 20, and resiliently maintains the thermal interface between the die and the heat dissipation apparatus in a manner preventing the creation of an impermissibly high mechanical contact pressure on the die 64.

In the illustrated preferred embodiment thereof, the heat dissipation apparatus 66 includes a thermal interface pad 68; an aluminum heat sink member or “slug” 70; a thermosyphoning heat pipe 72; the EMI shield wall 42; a schematically depicted cooling fan 74; and a clamping structure 76. The pad 68 (see FIG. 3) is disposed on the top side 64 a of the die 64, and has a periphery aligned with the top side periphery of the die 64. If desired, the pad 68 could be a conventional phase change thermal interface pad.

The metal heat sink member 70 has opposite ends 70 a and 70 b, a partially circular cross-section along its length, a flat bottom side 78 that faces the top side of the thermal pad 68, an arcuate top side 80, and a circular opening 82 extending between its opposite ends 70 a,70 b.

Thermosyphoning heat pipe 72 is of a conventional construction, forms with the shield wall 42 a heat transfer portion of the overall heat dissipation apparatus 55, and has a circularly cross-sectioned evaporating or heat-receiving end portion 72 a journaled within the heat sink opening 82 and surrounded in the opening 82 by a thin layer of silicon free thermal grease 84, and a flattened condensing or heat-dissipating end portion 72 b. Brackets 86 spaced apart along the length of the flattened heat pipe condensing end portion 72 b secure it to the bottom shield wall side 42 b, in thermal communication therewith, as best illustrated in FIG. 7. Alternatively, the condensing portion 72 b of the heat pipe 72 could be secured to a heat sink other than the shield wall 42 such as, for example, a portion of the computer system chassis (not shown).

This connection of the heat pipe portion 72 b to the metal shield wall 42 places the heat pipe evaporating end portion 72 a, and the heat sink member 70 which is pivotally mounted thereon, in a cantilevered, resiliently deflectable relationship with the underside 42 b of the metal shield wall 42. Thus, the heat sink member 70 may be resiliently deflected, as later described herein, downwardly away from the shield wall 42 toward the die 64. In addition to improving the heat transfer from the heat pipe 72 to the shield wall 42, the flattening of the heat pipe portion 72 b also facilitates the deflection of the heat sink member 70 toward the die 64. The heat sink member 70, as best illustrated in FIG. 6, underlies a rectangular opening 88 in the shield wall 42. Downturned wall tabs 90 on opposite sides of the opening 88 (see FIG. 6) are positioned outwardly adjacent the opposite ends 70 a,70 b of the heat sink member 70, and overlie portions of the heat pipe condensing end section 72 a and define stops which, when abutted by such heat pipe portions, limit the upward movement of the heat sink member 70 relative to the EMI shield wall 42.

The clamping structure 76, by exerting a resilient force on the heat sink member 70, functions to downwardly press the flat bottom side 78 of the heat sink member 70 against the top side of the phase change thermal pad 68, thus pressing the thermal pad 68 downwardly against the top side 64 a of the die 64. Clamping structure 76 includes (1) a generally U-shaped metal base plate portion 92 that extends across the bottom side 60 of the processor housing 56 and has upturned opposite side portions 94 and 96 that extend upwardly along opposite vertical sides of the processor housing 56 and are secured thereto by screws 98, and (2) an elongated rectangular spring plate portion 100 that extends along the arcuate top side 80 of the heat sink member 70.

Cooling fan 74, as schematically illustrated in FIGS. 6 and 7, is mounted in a notched end area 102 of the shield wall 42 and is positioned within the interior of the base housing 26 in an inwardly adjacent, facing relationship with an air discharge opening structure 104 formed in the left end wall 32 of the base housing 26 (see FIG. 4). During operation of the fan 74, ambient cooling air 106 (see FIG. 2) is sequentially drawn inwardly through an air intake opening area 108 in the right end wall 34 of the base housing 26 into the interior of the base housing 26, flowed through the interior of the base housing along the top and bottom sides 42 a,42 b of the metal shield wall 42, and then flowed through the fan 74 and discharged outwardly through the air discharge opening structure 104 (see FIG. 4).

The heat dissipation apparatus 66 is thermally connected to the processor die 64 (see FIG. 3) by placing the phase change thermal pad 68 on the top side of the die 64, and positioning the heat sink member 70, flat side 78 down, over the pad 68 as schematically indicated in FIG. 3. An upturned right end portion 100 a of the spring plate member 100 is then releasably retained under a curved upper end portion 96 a of the vertical side portion 96 of the clamping structure base portion 92, and the spring plate member 100 is leftwardly bent over the arcuate top side 80 of the heat sink member 70 pivotally mounted on the cantilevered heat pipe evaporating end portion 70 a until a left end portion 100 b of the spring plate member 100 downwardly engages the upper end of the left vertical side portion 94 of the clamping structure base portion 92.

Still referring to FIG. 3, the left spring plate member end portion 100 b is then releasably secured to the upper end of the vertical side portion 94 by a screw 110. The bending over the curved top side 80 of the heat sink member 70 of the elongated spring plate member 100 exerts a resilient downward force on the heat sink member 70 and resiliently deflects the cantilevered heat pipe evaporating end portion 72 a downwardly to thereby resiliently press the flat bottom side 78 of the heat sink member 70 against the phase change thermal pad 68 to correspondingly press the pad 68 downwardly against the top side 64 a of the heat-generating die 64 and operatively place the heat sink member 70 in heat-receiving proximity to the top side surface 64 a of the recessed die 64. The use of the spring plate member 100 serves to automatically preclude the exertion of an excess clamping contact pressure on the die 74, regardless of how tightly the screw 110 is threaded into the vertical side portion 94.

During operation of the portable computer 24, operating heat generated by the die 64 is transferred sequentially through the phase change pad 68 to the heat sink member 70, from the heat sink member 70 to the evaporating end portion 72 a of the heat pipe 72 via the annular layer of thermal grease 84, from the heat pipe end portion 72 a to the metal shield wall 42 via the condensing end portion 72 b of the heat pipe 72, and from the metal shield wall 42 to the cooling air 106 being flowed along the opposite sides 42 a,42 b of the metal shield wall 42 and then discharged from the base housing 26 via the air discharge opening structure 104.

The resiliently deflectable mounting of the heat sink member 70 on the cantilevered heat pipe evaporating end portion 72 a, coupled with the resilient downward clamping force exerted on the heat sink member 70 permits the heat dissipation apparatus 66 to automatically compensate for variances in the bond line distance of the microprocessor 20, while at the same time providing a controllable resilient clamping force on the die 64. Specifically, the spring plate member 100 can easily be designed in a manner such that when the bond line distance is at the lower limit of its tolerance range the clamping force on the die 64 does not exceed its maximum permitted value.

This unique feature of the heat dissipation apparatus 66 makes it substantially independent of the bond line thickness of the microprocessor 20, and further eliminates the previous necessity of using thermal grease at the interface between the top side of the die and the heat sink portion of the die heat dissipation apparatus. In place of the undesirable thermal grease interface, the apparatus 66 advantageously permits the use of the compressible interface pad 68. Since the pad in its uncompressed state does not have to project upwardly beyond the top side 58 of the processor housing 56 it can be of a very small thickness (as schematically illustrated in FIG. 3) to thereby provide a highly efficient heat conduction path between the die 64 and the heat sink member 70.

The unique shape of the heat sink member 70, with its arcuate top side 80 and its flat bottom side 78, coupled with the pivotal mounting of the heat sink member 70 on the evaporating end portion 72 a of the thermosyphoning heat pipe 72 makes the heat dissipation apparatus 66 self-adjusting in another manner. Specifically, in the event that the flat bottom side 78 of the heat sink member 70 is not precisely parallel to the top side 64 a of the die 64 before the spring plate member 100 is installed, the subsequent downward force of the spring plate member 100 on the curved upper side 80 of the heat sink member 70 will automatically pivot the heat sink member 70 about the heat pipe end portion 72 a, when the bottom side of the heat sink member initially contacts the phase change thermal pad 68, in a manner such that the flat bottom side 78 of the heat sink member 70 bears against the pad 68 in a precisely parallel relationship with the top side 64 a of the die 64.

While a preferred embodiment of the heat dissipation apparatus 66 has been representatively illustrated as being utilized in conjunction with a microprocessor in a portable computer, it will be readily appreciated by those of skill in this particular art that heat dissipation principles of the present invention could also be advantageously utilized in conjunction with a variety of other types of heat-generating components incorporated in other types of computers or electronic apparatus, the heat dissipation apparatus 66 not being limited to use in conjunction with a recessed processor die surface.

Illustrated in FIGS. 8 and 9 is an alternate embodiment 66 a of the previously described heat dissipation apparatus 66. For ease in comparison with the heat dissipation apparatus 66, components in the apparatus 66 a identical to those in apparatus 66 have been given the same reference numerals, while altered components in the apparatus 66 a have been given new reference numerals.

The heat dissipation apparatus 66 a is basically the same as the previously described heat dissipation apparatus 66 with the exception that the separate rotatable heat sink member 70 (see FIGS. 3 and 5) is replaced with a laterally enlarged heat sink section 120 formed integrally on the evaporating end portion 72 a of the heat pipe 72. The integral heat sink section 120 has opposite end portions 120 a and 120 b, a flat bottom side 122, and an arcuate top side 124.

In a manner similar to that previously described in conjunction with the rotatable heat sink member 70, the spring plate 100 engages the arcuate top side 124 of the integral heat sink section 120 and resiliently holds the flat bottom side of the heat sink section 120 against the thermal pad 68. Due to the cantilevered support of the evaporating heat pipe end portion, a slight twisting of the integral heat sink section 120 about the axis of the heat pipe end portion 72 a is permitted to assure that the flat bottom side 122 of the resiliently clamped-down heat sink section 120 is precisely parallel to the top side 64 a of the die 64.

Because the heat sink section 120 is formed integrally with the heat pipe evaporating end portion 72 a, there is no separate thermal interface area between the heat sink section 120 and the main body of the heat pipe 72. Accordingly, the overall heat dissipation efficiency of the apparatus 66 a is desirably enhanced.

The foregoing detailed description is to be clearly understood as being given by way of illustration and example only, the spirit and scope of the present invention being limited solely by the appended claims. 

What is claimed is:
 1. Electronic apparatus comprising: a component having a surface through which operating heat is generated; and heat dissipation apparatus for dissipating operating heat from said surface, including: a thermosyphoning heat pipe having an evaporating end portion supported for resilient deflection toward said surface, said evaporating end portion having an integral, laterally enlarged heat sink section with a flat first side positionable in parallel, heat-receiving proximity with said surface in response to resilient deflection of said evaporating end portion toward said surface, and a convexly arcuate second side opposite said first side, and a force exerting structure operative to engage said second side and resiliently deflect said evaporating end portion toward said surface.
 2. The electronic apparatus of claim 1 wherein said electronic apparatus is a computer.
 3. The electronic apparatus of claim 2 wherein said computer is a portable computer.
 4. The electronic apparatus of claim 1 wherein said component is a microprocessor.
 5. The electronic apparatus of claim 4 wherein: said microprocessor includes an exterior wall with a recess formed therein, and a die portion inset within said recess and having a side surface, and said surface of said component is defined by said side surface of said die portion.
 6. The electronic apparatus of claim 1 wherein: said heat dissipation apparatus further includes a thermal interface pad positioned on said surface, and said force exerting structure is operative to resiliently deflect said integral, laterally enlarged heat sink member into forcible contact with said thermal interface pad.
 7. The electronic apparatus of claim 6 wherein said thermal interface pad is a phase change thermal pad.
 8. The electronic apparatus of claim 1, wherein said evaporating end portion of said heat pipe is supported in a cantilevered manner.
 9. The electronic apparatus of claim 1 wherein: said heat dissipation apparatus further includes a shield wall, and said heat pipe has a condensing portion supported on said shield wall in a heat transfer relationship therewith.
 10. The electronic apparatus of claim 9 wherein said heat dissipation apparatus further includes a fan operative to flow cooling air along said wall structure to dissipate heat therefrom.
 11. The electronic apparatus of claim 1 wherein said force exerting structure is operative to exert a resilient force on said integral heat sink section.
 12. The electronic apparatus of claim 1 further comprising a housing portion within which said component and said heat dissipation apparatus are operatively disposed.
 13. The electronic apparatus of claim 12 wherein said housing is a portable notebook computer base housing.
 14. Electronic apparatus comprising: a component having a surface through which operating heat is generated; and heat dissipation apparatus for dissipating operating heat from said surface, including: a thermosyphoning heat pipe having an evaporating end portion supported for resilient deflection toward said surface, said evaporating end portion having an integral, laterally enlarged heat sink section with a flat first side positionable in parallel, heat-receiving proximity with said surface in response to resilient deflection of said evaporating end portion toward said surface, and a convexly arcuate second side opposite said first side, and a force exerting structure operative to engage said second side and resiliently deflect said evaporating end portion toward said surface; said heat dissipation apparatus further including a heat conductive wall structure, and said heat pipe having a condensing portion supported on said wall structure in a heat transfer relationship therewith, wherein said condensing portion has a flattened configuration along its length, and said evaporating portion has a circular cross-section.
 15. Electronic apparatus comprising: a microprocessor having a housing with an exterior wall having a recess formed therein, and a die portion inset within said recess and having a side surface; and heat dissipation apparatus operative to dissipate microprocessor operating heat from said side surface of said die portion, including: a thermosyphoning heat pipe having an evaporating end portion supported for movement toward and away from said side surface of said die portion, said evaporating end portion having an integral, laterally enlarged heat sink section with a flat first side movable into said recess and positionable in parallel, heat-receiving proximity with said side surface of said die portion, and a convexly arcuate second side opposite said first side, and a force exerting structure operative to engage said second side and resiliently hold said integral heat sink section in parallel, heat receiving proximity with said side surface of said die portion.
 16. The electronic apparatus of claim 15 wherein said electronic apparatus is a computer.
 17. The electronic apparatus of claim 16 wherein said computer is a portable computer.
 18. The electronic apparatus of claim 15 wherein said heat pipe evaporating end portion is resiliently deflectable toward said side surface of said die portion.
 19. The electronic apparatus of claim 15 wherein: said heat dissipation apparatus further includes a thermal interface pad positioned on said side surface of said die portion, and said force exerting structure is operative to resiliently press said integral heat sink section against said thermal interface pad.
 20. The electronic apparatus of claim 15 wherein said force exerting structure includes a clamping structure having a movable resilient spring member operable to forcible engage said convexly arcuate second side of said integral heat sink section to resiliently hold said integral heat sink section in parallel, heat-receiving proximity with said side surface of said die portion.
 21. The electronic apparatus of claim 20 wherein said clamping structure is mounted on said housing, and said spring member is resiliently engageable with said second side of said integral heat sink section. 